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ȿ ܰ濵

̱ ޸ ݵü ȸ ũ ũ 2000 ޷ õ Ը ȹ ǥߴ. ߰ ̱ 6 ÷ ż D 40% ڱ ϰڴٴ ̴. ̴ Ʈ ݵü '¼(On-Shoring)' å ߸ ؼȴ. Ｚڿ SK̴н ̾ 3 ӹ ִ ũ ̷ Ը ڴ ѱ ݵü û Ⱘ ϰ ִ.

WSTS(ݵüⱸ) 2025 ۷ι ݵü 11.2% Ͽ 6970 ޷ ߴ. 2026 · 8.5% ߴ. WSTS AI Ȯ 뿪޸(HBM) 䰡 ũ þ , ޸ ι ݵü ٺô. HBM ƴ϶, ü鵵 AI  ǰ 鼭 ΰġ ޸ Ȯ ߴ. ݵü ũ D, (NAND), HBM ޸ ݵü ߾óġ(CPU), ׷óġ(GPU) Ĩ ϴ ý ݵü . Ｚڿ SK̴н D HBM ߽ ޸ 忡 ѷ ϰ ִ.

̱ݵüȸ(SIA) ǥ '2025 Ʈ' , ޸ ݵü 79.3% ߴ. ü Ը ݵü(2158 ޷) ޸ ݵü(1655 ޷) 1.3 ũ, Ⱓ 20.8% ϸ, ɼ ũ.

۳⿡ ޸ ݵü ַ ϴ ѱ ۷ι ݵü 忡 ε巯 弼 . ü Ʈʿ , Ｚڴ ݵü 665 ޷ ϸ 10.6% 1 ö. 62.5% ġ. SK̴н 428 ޷ 86.0% ߴ. ݵü 10 ü , 6.8%.

ġ ȸ ȵƿ , ݳ 1б , ۷ι D SK̴н 36.9%, Ｚ 34.4%, ũ 25.0%̴. D SK̴н 1 Ｚڰ 1992 D 1 33 ̴. ޸ 忡 D ϴ 60%. SK̴н D 1 HBM Ǵ. HBM ū κ ȭϸ, 70% ̻ ϰ ֱ ̴.

̷ Ȳ ֱ ũ ޸ 'ķ(SOCAMM)' ƿ ǰ 鼭 忡 ְ ִ. ƴ Ｚ, SK̴н, ũ ķ Ƿߴµ, ũ ǰ ߴ. 1, 2 Ｚڿ SK̴н ġ ũ ֵ ̴. ũ ֱ ˷. ķ AI ӱ ''  ̴. Ｚڿ SK̴н ķ ϷϿ, ǰ ̾ ʰ ִ.

ķ 'System-On-Chip Advanced Materials & Manufacturing' ڷ ý ݵü ÷ ǹѴ. AI ݵü ȿ ο ÷ ̴. HBM ̾ AI ݵü ǵ ٲ ִ ٽ ϱ⵵ Ѵ. ݳ ķ ϰ ִ. ũ پ 纸 20% ̻ ȿ δٰ ȫϰ ִ.

ķ ư ο ǻ '' ɼ Ƽ, 䰡 ũ þ ִ. ޸ 3簡 ̰ ߰ θ . ׷ 3 ũ ϰ ο ̴.

ɰ ũ 6 HBM HBM4 ƿ ߴٴ ̴. SK̴н ũк 3 3 HBM4 ϰ Ϲݱ غϰ , Ｚڴ HBM4 ܰ ǰ HBM3E '׽Ʈ(ǰ )' ӹ ִ ´. SK̴н ʷ HBM4 , ũ 3 ¦ پ. 'HBM4 ' ŸƲ ָȴ. D Ϸ HBM4 ؾ Ѵ. ִ ÿ ޷ȴ.

ũ S25 ø Ｚ ݵü ġ D ʵ κ ˷. ũ Ｚ Ʈ '1 ޸ ' ̴. ũ ðѾ ݳ ʺ 6 16ϱ 31.5% , ֱ 2 237% ö. ݵü ðѾ 11̸, SK̴н 12.

̷ ũ 󺸴 ӵ 1, 2 Ｚڿ SK̴н ߿Ϸ ϰ ִ ̴. HBM SK̴н ϰ , ȴ. SK̴н 3 HBM4 ó ƿ ߰, Ϲݱ ǥ. SK̴н HBM ؿ ° ȹ HBM4 ϰ, 굵 ö غ ؼ AI ޸ θ Űڴٴ ̴. Ĺ Ｚڴ ׽Ʈ ϰ , ٸ 麸 ռ D(1c) HBM4 ȹ̴. 1c D 1b D ǰ Һ ֽ 򰡹ް ִ.

ũ پ ߿ Ȱ HBM ȴ. HBM 븦 ŵҼ D ׾ƾ ϴµ, D ڰ þ ʿ ߻ϱ ũ ̴. ũ HBM ڴʰ پ پ ߿ ̱ ̶ ޼ϰ ִ ̴. ߱ Ϻ ޸ 忡 پ鼭 ޸ ֵ ġ ִ. ޸ ߱ Ѿ , Ϻ HBM ü ޸𸮿 ϰ ִ. ̴ ѱ ݵü ⸦ ǹѴ.

ݵü ǻ ' '̴. ȸ "ѹα ̷ ݵü ޷ ִ" ؿԴ. ׷ ܼ ȣ ļ ȴ. ¸ ؼ پ , ڱ, ׸ ʼ. ߿ . ٽ ѹ ݵü DZ⸦ Ѵ.